Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	08-3518-10 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	672	$0.87		518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	PLCC-44-AT-SMT PLCC SOCKET 44P SMT Adam Tech	125	$0.87		PLCC	Tube	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Thermoplastic	-55°C ~ 105°C
	4824-3000-CP CONN IC DIP SOCKET 24POS TIN 3M	848	$0.88		4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
	4824-6000-CP CONN IC DIP SOCKET 24POS TIN 3M	377	$0.88		4800	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
	110-99-314-41-001000 CONN IC DIP SOCKET 14POS TINLEAD Mill-Max Manufacturing Corp.	636	$0.90		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	1-2199298-9 CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors	959	$0.87		Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled	-40°C ~ 105°C
	1-2199299-2 28P,DIP SKT,600 CL,LDR,PB FREE TE Connectivity AMP Connectors	983	$0.86		Diplomate DL	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Nickel	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
	110-41-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	905	$0.90		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	4828-3004-CP CONN IC DIP SOCKET 28POS TIN 3M	906	$0.94		4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
	110-87-318-41-001101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	919	$0.99		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	4828-6000-CP CONN IC DIP SOCKET 28POS TIN 3M	718	$0.98		4800	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
	4832-6000-CP CONN IC DIP SOCKET 32POS TIN 3M	77	$0.97		4800	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
	210-43-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	103	$0.96		210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	4828-6004-CP CONN IC DIP SOCKET 28POS TIN 3M	218	$0.98		4800	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
	1-2199300-2 CONN IC DIP SOCKET 32POS TINLEAD TE Connectivity AMP Connectors	232	$0.97		Diplomate DL	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin-Lead	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame, No Center Bar	Solder	0.100" (2.54mm)	Tin-Lead	60.0µin (1.52µm)	Brass, Copper	Polyester	-55°C ~ 125°C
	110-43-306-41-001000 CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp.	372	$1.02		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-99-316-41-001000 CONN IC DIP SOCKET 16POS TINLEAD Mill-Max Manufacturing Corp.	191	$1.01		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	4840-6000-CP CONN IC DIP SOCKET 40POS TIN 3M	262	$1.06		4800	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
	05-0513-10T CONN SOCKET SIP 5POS GOLD Aries Electronics	584	$1.08		0513	Bulk	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	4840-6004-CP CONN IC DIP SOCKET 40POS TIN 3M	520	$1.15		4800	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C