Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	299-43-310-10-001000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	116	$4.54		299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	ICA-640-STT CONN IC DIP SOCKET 40POS TIN Samtec Inc.	51	$5.27		ICA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
	840-AG11D-ESL-LF CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors	37	$5.45		800	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
	123-13-316-41-001000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	49	$5.99		123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	XR2A-3201-N CONN IC DIP SOCKET 32POS GOLD Omron Electronics Inc-EMC Div	116	$6.29		XR2	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
	110-93-628-41-801000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	38	$6.96		110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	XR2P2041 CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div	43	$8.07		XR2	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Threaded	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
	32-C182-10 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	5	$8.13		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	10-2820-90T CONN IC DIP SOCKET 10POS TIN Aries Electronics	63	$8.36		Vertisockets™ 800	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	10-2810-90T CONN IC DIP SOCKET 10POS TIN Aries Electronics	67	$8.74		Vertisockets™ 800	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	10-2822-90 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	31	$9.42		Vertisockets™ 800	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	117-93-764-41-005000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	13	$9.44		117	Tube	Active	DIP, 0.75" (19.05mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-93-640-41-801000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	51	$11.23		110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	12-6810-90C CONN IC DIP SOCKET 12POS GOLD Aries Electronics	46	$12.71		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	APA-628-G-A1 ADAPTER PLUG Samtec Inc.	51	$14.84		APA	Bulk	Active	-	28 (2 x 14)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
	28-823-90C CONN IC DIP SOCKET 28POS GOLD Aries Electronics	50	$15.70		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	24-6574-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	12	$15.62		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	28-516-11 CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics	15	$15.86		516	Bulk	Active	DIP, ZIF (ZIP)	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	28-6574-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	33	$16.93		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	40-516-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	32	$20.29		516	Bulk	Active	DIP, ZIF (ZIP)	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-