Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	ICM-318-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 18P Adam Tech	703	$1.02		ICM	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
	110-44-316-41-001000 CONN IC DIP SOCKET 16POS TIN Mill-Max Manufacturing Corp.	95	$1.02		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	D2808-42 CONN IC DIP SOCKET 8POS GOLD Harwin Inc.	332	$1.18		D2	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
	110-47-422-41-001000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	388	$1.38		110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-44-324-41-001000 CONN IC DIP SOCKET 24POS TIN Mill-Max Manufacturing Corp.	551	$1.42		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	ICM-328-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 28P Adam Tech	670	$1.41		ICM	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
	110-99-328-41-001000 CONN IC DIP SOCKET 28POS TINLEAD Mill-Max Manufacturing Corp.	157	$1.62		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	SA406000 CONN IC DIP SOCKET 40POS GOLD On Shore Technology Inc.	132	$1.71		SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
	123-87-314-41-001101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	18	$1.88		123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	8444-21A1-RK-TP CONN SOCKET PLCC 44POS TIN 3M	259	$2.08		8400	Tube	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
	XR2C1011N CONN SOCKET SIP 10POS GOLD Omron Electronics Inc-EMC Div	73	$2.21		XR2	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Threaded	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
	D2820-42 CONN IC DIP SOCKET 20POS GOLD Harwin Inc.	65	$2.33		D2	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
	110-93-328-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	168	$2.58		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	224-5248-00-0602J CONN IC DIP SOCKET ZIF 24POS GLD 3M	3	$30.41		Textool™	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	232-1287-00-0602J CONN IC DIP SOCKET ZIF 32POS GLD 3M	22	$38.76		Textool™	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	240-3639-00-0602J CONN IC DIP SOCKET ZIF 40POS GLD 3M	2	$41.22		Textool™	Bulk	Active	DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	24-6554-16 CONN IC DIP SOCKET ZIF 24POS Aries Electronics	17	$48.17		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	280-5205-01 CONN SOCKET QFN 80POS GOLD 3M	4	$147.30		Textool™	Bulk	Active	QFN	80 (4 x 20)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.020" (0.50mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
	06-0518-10 CONN SOCKET SIP 6POS GOLD Aries Electronics	363	$0.97		518	Bulk	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	06-0518-10H CONN SOCKET SIP 6POS GOLD Aries Electronics	854	$1.14		518	Bulk	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-