Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	110-83-308-41-530000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	12	$69.78		110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-83-314-41-530000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	11	$69.34		110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-83-316-41-530000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	6	$69.37		110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-83-318-41-530000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	5	$69.73		110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-83-628-41-530000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	7	$71.58		110	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	200-6317-9UN-1900 CONN SOCKET PGA ZIF 289POS GOLD 3M	3	$72.80		Textool™	Bulk	Obsolete	PGA, ZIF (ZIP)	289 (17 x 17)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)	-55°C ~ 150°C
	235-3019-01-0602 CONN ZIG-ZAG ZIF 35POS GOLD 3M	2	$94.15		Textool™	Bulk	Active	Zig-Zag, ZIF (ZIP)	35 (1 x 17, 1 x 18)	0.050" (1.27mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	XR2A-0815 CONNECTORS - CONNECTOR Omron Electronics Inc-EMC Div	1,097	$0.88			Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	10-2810-90 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	50	$9.65		Vertisockets™ 800	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	14-810-90 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	26	$10.41		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	220-3342-00-0602J CONN IC DIP SOCKET ZIF 20POS GLD 3M	26	$22.11		Textool™	Tube	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	240-1280-00-0602J CONN IC DIP SOCKET ZIF 40POS GLD 3M	33	$28.21		Textool™	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	264-5205-01 CONN SOCKET QFN 64POS GOLD 3M	5	$132.45		Textool™	Bulk	Active	QFN	64 (4 x 16)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.020" (0.50mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
	ICS-316-T IC SOCKET, DIP, 16P 2.54MM PITCH Adam Tech	3,261	$0.18		ICS	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
	ICS-314-T IC SOCKET, DIP, 14P 2.54MM PITCH Adam Tech	2,520	$0.19		ICS	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
	ICS-640-T IC SOCKET, DIP, 40P 2.54MM PITCH Adam Tech	707	$0.40		ICS	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
	SA163040 CONN IC DIP SOCKET 16POS GOLD On Shore Technology Inc.	1,130	$0.84		SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
	110-44-314-41-001000 CONN IC DIP SOCKET 14POS TIN Mill-Max Manufacturing Corp.	696	$0.90		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	ICM-316-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 16P Adam Tech	259	$0.89		ICM	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
	SA203000 CONN IC DIP SOCKET 20POS GOLD On Shore Technology Inc.	888	$0.92		SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C