Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	FMC05DRTN-S1682 CONN TRANSIST TO-220/TO-247 5POS Sullins Connector Solutions	36	$15.54			Tray	Active	Transistor, TO-220 and TO-247	5 (Rectangular)	-	Gold	30.0µin (0.76µm)	Nickel Boron	Through Hole	-	Solder	-	Gold	30.0µin (0.76µm)	Nickel Boron	Polyphenylene Sulfide (PPS)	-65°C ~ 200°C
	28-526-11 CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics	17	$18.20		Lo-PRO®file, 526	Bulk	Active	DIP, ZIF (ZIP)	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	209-PGM17020-10 CONN SOCKET PGA GOLD Aries Electronics	39	$20.59		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	232-1285-00-0602J CONN IC DIP SOCKET ZIF 32POS GLD 3M	5	$25.49		Textool™	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	242-1281-00-0602J CONN IC DIP SOCKET ZIF 42POS GLD 3M	20	$27.64		Textool™	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	256-1292-00-0602J CONN IC DIP SOCKET ZIF 56POS GLD 3M	2	$42.39		Textool™	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	56 (2 x 28)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	228-7396-55-1902 CONN SOCKET SOIC 28POS GOLD 3M	18	$46.23		Textool™	Bulk	Active	SOIC	28 (2 x 14)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
	232-2601-00-0602 CONN SOCKET SIP ZIF 32POS GOLD 3M	14	$52.32		Textool™	Bulk	Active	SIP, ZIF (ZIP)	32 (1 x 32)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	236-6225-00-0602 CONN SOCKET SIP ZIF 36POS GOLD 3M	4	$56.04		Textool™	Bulk	Active	SIP, ZIF (ZIP)	36 (1 x 36)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	216-5205-01 CONN SOCKET QFN 16POS GOLD 3M	3	$93.41		Textool™	Bulk	Active	QFN	16 (3x3)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
	44-547-11 CONN SOCKET SOIC ZIF 44POS GOLD Aries Electronics	5	$217.87		547	Bulk	Active	SOIC, ZIF (ZIP)	44 (2 x 22)	-	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	84-537-21 CONN SOCKET PLCC ZIF 84POS GOLD Aries Electronics	4	$309.29		537	-	Active	PLCC, ZIF (ZIP)	84 (4 x 21)	0.100" (2.54mm)	Gold	12.0µin (0.30µm)	-	Surface Mount	Closed Frame	-	-	-	-	-	-	-
	317-47-108-41-005000 CONN SOCKET SIP 8POS GOLD Mill-Max Manufacturing Corp.	703	$1.34		317	Tube	Active	SIP	8 (1 x 8)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-99-424-41-001000 CONN IC DIP SOCKET 24POS TINLEAD Mill-Max Manufacturing Corp.	293	$1.41		110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-47-318-41-003000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	221	$1.48		115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	210-47-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	294	$1.82		210	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-43-210-10-001000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	166	$1.88		110	Tube	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5), 6 Loaded	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	214-99-318-01-670800 CONN IC DIP SOCKET 18POS TINLEAD Mill-Max Manufacturing Corp.	20	$2.20		214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	317-47-121-41-005000 CONN SOCKET SIP 21POS GOLD Mill-Max Manufacturing Corp.	8	$2.48		317	Tube	Active	SIP	21 (1 x 21)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-43-318-41-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	362	$2.48		115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C