Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	40-C182-10 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	76	$10.23		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	24-526-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	58	$11.41		Lo-PRO®file, 526	Bulk	Active	DIP, ZIF (ZIP)	24 (2 x 12)	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	ICF-640-S-O CONN IC DIP SOCKET 40POS TIN Samtec Inc.	46	$13.53		iCF	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
	218-3341-00-0602J CONN IC DIP SOCKET ZIF 18POS GLD 3M	37	$23.02		Textool™	Tray	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	228-1277-00-0602J CONN IC DIP SOCKET ZIF 28POS GLD 3M	8	$25.59		Textool™	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	228-1290-00-0602J CONN IC DIP SOCKET ZIF 28POS GLD 3M	21	$26.80		Textool™	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	40-6554-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	16	$27.53		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	224-1286-00-0602J CONN IC DIP SOCKET ZIF 24POS GLD 3M	8	$29.14		Textool™	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	214-7390-55-1902 CONN SOCKET SOIC 14POS GOLD 3M	6	$33.91		Textool™	Bulk	Active	SOIC	14 (2 x 7)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
	228-1371-00-0602J CONN IC DIP SOCKET ZIF 28POS GLD 3M	3	$35.84		Textool™	Tray	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	216-7383-55-1902 CONN SOCKET SOIC 16POS GOLD 3M	17	$37.30		Textool™	Bulk	Active	SOIC	16 (2 x 8)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
	220-7201-55-1902 CONN SOCKET SOIC 20POS GOLD 3M	22	$41.78		Textool™	Bulk	Active	SOIC	20 (2 x 10)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
	240-1288-00-0602J CONN IC DIP SOCKET ZIF 40POS GLD 3M	5	$45.17		Textool™	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	264-4493-00-0602J CONN IC DIP SOCKET ZIF 64POS GLD 3M	4	$55.43		Textool™	Tube	Active	DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	240-5205-00 CONN SOCKET QFN 40POS GOLD 3M	4	$91.08		Textool™	Bulk	Active	QFN	40 (4 x 10)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
	224-5205-01 CONN SOCKET QFN 24POS GOLD 3M	5	$97.51		Textool™	Bulk	Active	QFN	24 (4x4)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
	228-5204-01 CONN SOCKET QFN 28POS GOLD 3M	4	$102.77		Textool™	Bulk	Active	QFN	28 (4 x 7)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
	232-5205-01 CONN SOCKET QFN 32POS GOLD 3M	7	$106.35		Textool™	Bulk	Active	QFN	32 (4 x 8)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
	288-4205-01 CONN SOCKET QFN 88POS GOLD 3M	2	$167.59		Textool™	Bulk	Active	QFN	88 (4 x 22)	0.016" (0.40mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.016" (0.40mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
	EDO-32PLCZSM CONN SOCKET PLCC 32POS On Shore Technology Inc.	589	$0.72		ED	Tube	Active	PLCC	32 (2 x 16)	0.050" (1.27mm)	-	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	-	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 105°C