Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	299-43-324-11-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	48	$20.83		299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	299-93-622-10-002000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	21	$22.18		299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	1051420132 CONN SOCKET LGA 2011POS GOLD Molex	18	$23.41		105142	Bulk	Obsolete	LGA	2011 (47 x 58)	0.040" (1.02mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.040" (1.01mm)	-	-	-	Thermoplastic	-
	123-43-950-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	24	$26.53		123	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	123-43-640-41-801000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	29	$26.66		123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	2174988-2 CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors	6	$29.09			Bulk	Last Time Buy	LGA	2011 (47 x 58)	0.040" (1.02mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.035" (0.90mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic	-
	299-93-636-10-002000 CONN IC DIP SOCKET 36POS GOLD Mill-Max Manufacturing Corp.	19	$29.80		299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	200-6311-9UN-1900 CONN SOCKET PGA ZIF 121POS GOLD 3M	3	$52.99		Textool™	Bulk	Obsolete	PGA, ZIF (ZIP)	121 (11 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)	-55°C ~ 150°C
	200-6319-9UN-1900 CONN SOCKET PGA ZIF 361POS GOLD 3M	9	$97.17		Textool™	Bulk	Obsolete	PGA, ZIF (ZIP)	361 (19 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)	-55°C ~ 150°C
	105167-0001 6.50 BY 6.50MM CAMERA SOCKET, 4. Molex	112	$0.63			Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	105190-0001 7.50 BY 7.50MM CAMERA SOCKET, 4. Molex	980	$0.79			Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	105199-0001 8.50 BY 9.50MM CAMERA SOCKET, 4. Molex	253	$0.97			Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	105200-0008 5.50 BY 5.50MM CAMERA SOCKET, 3. Molex	545	$1.06			Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	47337-0001 8.50 BY 8.50MM CAMERA SOCKET, 4. Molex	63	$0.91			Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	78499-0002 6.50 BY 6.50MM CAMERA SOCKET, 3. Molex	747	$0.98			Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	78725-0002 SMIA85 CAMERA SOCKET T/BRD 18PIN Molex	450	$1.14			Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	47593-9000 1.01MM PITCH LGA 1366 PROCESSOR Molex	15	$10.99			Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	47594-0002 1.01MM BY 1.01MM PITCH LGA 1366 Molex	7	$27.62			Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	773	$0.93		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	8432-21B1-RK-TR CONN SOCKET PLCC 32POS TIN 3M	224	$2.13		8400	Tape & Reel (TR)	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C