Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	8060-1G12 CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors	3	$11.62		8060	Bulk	Obsolete	Transistor, TO-5	4 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Fluoropolymer (FP)	-55°C ~ 125°C
	8060-1G11 CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors	62	$12.52		8060	Bulk	Obsolete	Transistor, TO-5	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
	2350616-1 DUAL LGA,250 POS, DMD SOCKET TE Connectivity AMP Connectors	29	$13.80			Tray	Active	LGA	250 (16 x 25)	0.039" (1.00mm)	Gold	3.00µin (0.076µm)	Copper Alloy	Surface Mount	Board Guide, Open Frame	Solder	-	-	-	-	Thermoplastic	-25°C ~ 100°C
	299-43-632-10-002000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	32	$13.61		299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	840-AG10D CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors	412	$0.00		800	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
	8059-2G9 CONN TRANSIST TO-5 10POS GOLD TE Connectivity AMP Connectors	59	$15.32		8059	Bulk	Obsolete	Transistor, TO-5	10 (Round)	-	Gold	-	Copper Alloy	Through Hole	-	Solder	-	Gold	-	Copper Alloy	Polyamide (PA), Nylon, Glass Filled	-55°C ~ 125°C
	116-93-308-41-007000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	52	$15.55		116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-43-314-41-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$15.91		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-93-310-41-105000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	61	$16.07		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	101-93-422-41-560000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	50	$16.24		101	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-93-318-41-007000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	40	$17.78		116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	8060-1G5 CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors	4	$18.27		8060	Bulk	Obsolete	Transistor, TO-5	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
	123-93-320-41-801000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	22	$18.98		123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	123-43-422-41-001000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	10	$18.83		123	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	8058-1G49 CONN TRANSIST TO-5 8POS GOLD TE Connectivity AMP Connectors	37	$18.80		8058	Bulk	Obsolete	Transistor, TO-5	8 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
	123-43-318-41-801000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	28	$19.15		123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	123-43-424-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	33	$19.32		123	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-11-420-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	4	$19.50		612	Tube	Active	DIP, 0.1" (2.54mm) Row Spacing	-	0.039" (1.00mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.039" (1.00mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	210-13-640-41-001000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	30	$20.17		210	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	299-93-324-11-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	24	$21.11		299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C