Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	516-AG11D CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors	169	$5.36		500	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
	816-AG10D-ES CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors	67	$5.56		800	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Copper Alloy	Polyester	-55°C ~ 105°C
	299-43-306-10-001000 CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp.	135	$5.57		299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	117-43-430-41-005000 CONN IC DIP SOCKET 30POS GOLD Mill-Max Manufacturing Corp.	42	$5.64		117	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	30 (2 x 15)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	824-AG30D-ES CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors	80	$6.81		800	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
	299-43-318-11-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	30	$7.19		299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	524-AG10D-ES CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors	7	$7.19		500	Tube	Obsolete	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-55°C ~ 125°C
	540-AG11D-ES CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors	126	$7.33		500	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
	299-43-614-10-002000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	25	$7.96		299	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	528-AG11D CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	39	$7.91		500	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
	123-43-624-41-801000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	8	$8.34		123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	8058-1G23 CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors	40	$8.22		8058	Bulk	Obsolete	Transistor, TO-5	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
	828-AG11D CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	101	$6.99		800	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	80.0µin (2.03µm)	Copper Alloy	Polyester	-55°C ~ 105°C
	2041549-1 SOCKET ASSY, DMD 350, T/R, G/F TE Connectivity AMP Connectors	49	$9.30			Tape & Reel (TR)	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	8060-1G3 CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors	31	$8.64		8060	Bulk	Obsolete	Transistor, TO-5	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
	ICF-632-S-O-TR CONN IC DIP SOCKET 32POS TIN Samtec Inc.	83	$9.76		iCF	Tape & Reel (TR)	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
	8058-1G24 CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors	23	$9.06		8058	Bulk	Obsolete	Transistor, TO-5	4 (Round)	-	Gold	-	Beryllium Copper	Panel Mount	-	Solder Cup	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
	8060-1G13 CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors	234	$0.00		8060	Bulk	Obsolete	Transistor, TO-5	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
	12-8473-310C CONN IC DIP SOCKET 12POS GOLD Aries Electronics	35	$10.13		8	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	117-43-668-41-005000 CONN IC DIP SOCKET 68POS GOLD Mill-Max Manufacturing Corp.	17	$10.00		117	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	68 (2 x 34)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C