Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	4516 CONN TRANSIST TO-3 3POS TIN Keystone Electronics	203	$3.58			Bulk	Active	Transistor, TO-3	3 (Oval)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polybutylene Terephthalate (PBT)	-
	111-93-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	231	$3.69		111	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	111-43-632-41-001000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	193	$4.23		111	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-93-320-31-012000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	185	$4.54		614	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-43-320-31-012000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	159	$4.59		614	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-93-640-31-012000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	26	$8.04		614	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-13-628-41-801000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	31	$8.19		110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	299-93-618-10-002000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	91	$8.66		299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	317-43-108-41-005000 CONN SOCKET 8POS .070 STR GOLD Mill-Max Manufacturing Corp.	57	$9.85		317	Tube	Active	SIP	8 (1 x 8)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	3-1571550-0 CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors	47	$10.95		500	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	317-43-121-41-005000 CONN SOCKET 21POS .070 STR GOLD Mill-Max Manufacturing Corp.	48	$11.78		317	Tube	Active	SIP	21 (1 x 21)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	2319757-1 DUAL LGA,257 POS, DMD SOCKET TE Connectivity AMP Connectors	7	$18.35		DMD	Tray	Active	LGA	257 (20 x 30)	0.039" (1.00mm)	Gold	3.00µin (0.076µm)	Copper Alloy	Surface Mount	Board Guide, Open Frame	Solder	-	-	-	-	Thermoplastic	-25°C ~ 100°C
	8080-1G1-LF CONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors	31	$27.35		8080	Bulk	Active	Transistor, TO-3	3 (Oval)	-	Tin	200.0µin (5.08µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
	1-2324271-6 LEFT SEGMEN LGA4189-5 SOCKET-P5 TE Connectivity AMP Connectors	24	$28.68			Tray	Active	LGA 4189	2092	0.039" (1.00mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034" (0.86mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic	-25°C ~ 100°C
	1-2324271-5 RIGHT SEGMEN LGA4189-5 SOCKET-P5 TE Connectivity AMP Connectors	3	$28.87			Tray	Active	LGA 4189	2092	0.039" (1.00mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034" (0.86mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic	-25°C ~ 100°C
	2-2129710-7 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	30	$34.52			Tray	Active	LGA	3647	-	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Thermoplastic	-
	NTE423 SOCKET-MINI-DIP 8-PIN NTE Electronics, Inc	783	$0.45			Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	-	-	-	-	Through Hole	-	Solder	-	-	-	-	-	-
	DILB24P-224TLF CONN IC DIP SOCKET 24POS TINLEAD Amphenol ICC (FCI)	1,095	$0.85		DILB	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 125°C
	ICA-308-STT CONN IC DIP SOCKET 8POS TIN Samtec Inc.	427	$1.50		ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
	1050281001 CONN CAM SOCKET 32POS GOLD Molex	295	$2.19		105028	Tape & Reel (TR)	Active	Camera Socket	32 (4 x 8)	0.035" (0.90mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.035" (0.90mm)	Nickel	50.0µin (1.27µm)	Copper Alloy	Thermoplastic	-