Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	14-823-90 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	10	$10.49		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	10-810-90C CONN IC DIP SOCKET 10POS GOLD Aries Electronics	59	$11.07		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	14-810-90C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	38	$11.42		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	299-43-628-10-002000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	15	$11.95		299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	20-823-90 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	23	$12.67		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	16-2820-90C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	69	$12.42		Vertisockets™ 800	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	18-6810-90T CONN IC DIP SOCKET 18POS TIN Aries Electronics	65	$14.01		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	8080-1G1 CONN TRANSIST TO-3 4POS GOLD TE Connectivity AMP Connectors	28	$15.31		8080	Bulk	Active	Transistor, TO-3	4 (Round)	-	Tin-Lead	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin-Lead	-	Beryllium Copper	Fluoropolymer (FP)	-55°C ~ 125°C
	110-43-308-41-105000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	32	$15.22		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	8080-1G15 CONN TRANSIST TO-3 3POS TIN-LEAD TE Connectivity AMP Connectors	31	$16.00		8080	Bulk	Active	Transistor, TO-3	3 (Oval)	-	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Fluoropolymer (FP)	-55°C ~ 125°C
	8080-1G24 CONN SOCKET TRANSIST TO-3 3POS TE Connectivity AMP Connectors	52	$16.01			Bulk	Active	Transistor, TO-3	3 (Round)	-	Tin-Lead	20.0µin (0.51µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin-Lead	20.0µin (0.51µm)	Beryllium Copper	Diallyl Phthalate (DAP)	-55°C ~ 125°C
	APA-628-G-N ADAPTER PLUG Samtec Inc.	17	$19.33		APA	Tube	Active	-	28 (2 x 14)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
	2201838-1 CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors	18	$25.16			Bulk	Last Time Buy	LGA	2011 (47 x 58)	0.040" (1.02mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.035" (0.90mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic	-
	2-2822979-3 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	6	$63.92			Tray	Active	LGA	3647	0.039" (1.00mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034" (0.86mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic	-
	D2818-42 CONN IC DIP SOCKET 18POS GOLD Harwin Inc.	271	$2.12		D2	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
	117-87-432-41-005101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	212	$2.28		117	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	32 (2 x 16)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	115-93-318-41-003000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	49	$2.34		115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-43-422-41-003000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	240	$3.05		115	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	111-43-324-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	46	$3.20		111	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	214-99-632-01-670800 CONN IC DIP SOCKET 32POS TINLEAD Mill-Max Manufacturing Corp.	2	$3.28		214	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C