Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	28-526-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	37	$12.62		Lo-PRO®file, 526	Bulk	Active	DIP, ZIF (ZIP)	28 (2 x 14)	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	12-810-90C CONN IC DIP SOCKET 12POS GOLD Aries Electronics	3	$12.99		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	24-6554-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	32	$12.97		55	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	TDU03DTOD CONN SOCKET TRANSIST 3POS GOLD Sullins Connector Solutions	41	$13.65			Tray	Active	Transistor	3 (Rectangular)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Board Guide, Flange	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-55°C ~ 175°C
	714-43-164-31-018000 CONN SOCKET SIP 64POS GOLD Mill-Max Manufacturing Corp.	53	$13.65		714	Tube	Active	SIP	64 (1 x 64)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	25-0503-30 CONN SOCKET SIP 25POS GOLD Aries Electronics	59	$14.13		0503	Bulk	Active	SIP	25 (1 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA), Nylon, Glass Filled	-
	40-526-10 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	10	$15.03		Lo-PRO®file, 526	Bulk	Active	DIP, ZIF (ZIP)	40 (2 x 20)	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	28-6554-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	8	$14.90		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	TCC05DCSN-S1403 CONN TRANSIST TO-220/TO-247 5POS Sullins Connector Solutions	38	$15.27			Tray	Active	Transistor, TO-220 and TO-247	5 (Rectangular)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 175°C
	32-6554-10 CONN IC DIP SOCKET ZIF 32POS TIN Aries Electronics	51	$15.86		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	MPP-1100-05-DS-4GR(S1402) CONN TRANSIST TO-220/TO-247 5POS Sullins Connector Solutions	19	$16.98			Tray	Active	Transistor, TO-220 and TO-247	5 (Rectangular)	-	Gold	30.0µin (0.76µm)	Nickel Boron	Through Hole, Right Angle	-	Solder	-	Gold	30.0µin (0.76µm)	Nickel Boron	Polyphenylene Sulfide (PPS)	-65°C ~ 200°C
	40-6554-10 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	37	$18.90		55	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	24-6554-11 CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics	7	$19.30		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	48-6554-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	44	$19.49		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	28-6554-11 CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics	18	$20.58		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-6554-11 CONN IC DIP SOCKET ZIF 32POS GLD Aries Electronics	3	$23.07		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	222-3343-00-0602J CONN IC DIP SOCKET ZIF 22POS GLD 3M	18	$24.81		Textool™	Tube	Active	DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
	0804MC CONN TRANSIST TO-3 8POS GOLD Texas Instruments	32	$28.68			Tray	Active	Transistor, TO-3	8 (Oval)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyester, Glass Filled	-55°C ~ 150°C
	1-2324271-2 LEFT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors	29	$29.15			Tray	Active	LGA 4189	2092	0.039" (1.00mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034" (0.86mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic	-25°C ~ 100°C
	210-2599-00-0602 CONN SOCKET SIP ZIF 10POS GOLD 3M	4	$44.48		Textool™	Bulk	Active	SIP, ZIF (ZIP)	10 (1 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C