Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	110-44-964-41-001000 CONN IC DIP SOCKET 64POS TIN Mill-Max Manufacturing Corp.	177	$4.38		110	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-99-964-41-001000 CONN IC DIP SOCKET 64POS TINLEAD Mill-Max Manufacturing Corp.	36	$4.35		110	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	299-43-308-11-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	188	$4.58		299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	D2840-42 CONN IC DIP SOCKET 40POS GOLD Harwin Inc.	184	$4.59		D2	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
	110-47-964-41-001000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	58	$4.59		110	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-93-314-41-801000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	111	$4.91		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	299-43-312-11-001000 CONN IC DIP SOCKET 12POS GOLD Mill-Max Manufacturing Corp.	188	$5.10		299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	299-43-312-10-001000 CONN IC DIP SOCKET 12POS GOLD Mill-Max Manufacturing Corp.	56	$5.19		299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-93-320-41-801000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	152	$5.45		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-13-640-41-001000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	81	$5.62		110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	D01-9952042 CONN SOCKET SIP 20POS GOLD Harwin Inc.	5	$5.73		D01-995	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled	-55°C ~ 125°C
	299-93-314-10-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	50	$5.98		299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-13-320-41-801000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	71	$6.50		110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	40-0518-11 CONN SOCKET SIP 40POS GOLD Aries Electronics	19	$6.54		518	Bulk	Active	SIP	40 (1 x 40)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	117-43-642-41-005000 CONN IC DIP SOCKET 42POS GOLD Mill-Max Manufacturing Corp.	16	$6.62		117	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	20-0511-10 CONN SOCKET SIP 20POS TIN Aries Electronics	123	$6.75		511	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	299-43-320-10-001000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	91	$8.30		299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	10-2820-90C CONN IC DIP SOCKET 10POS GOLD Aries Electronics	96	$8.28		Vertisockets™ 800	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	12-823-90C CONN IC DIP SOCKET 12POS GOLD Aries Electronics	40	$9.28		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	14-810-90R CONN IC DIP SOCKET 14POS TIN Aries Electronics	58	$10.76		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-