XCZU5CG-1FBVB900I
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AMD Xilinx XCZU5CG-1FBVB900I

Manufacturer No:
XCZU5CG-1FBVB900I
Manufacturer:
AMD Xilinx
Package:
Tray
Datasheet:
XCZU5CG-1FBVB900I Datasheet
ECAD Model:
-
Description:
IC SOC CORTEX-A53 900FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Architecture:MCU, FPGA
Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:- 
RAM Size:256KB
Peripherals:DMA, WDT
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:500MHz, 1.2GHz
Primary Attributes:Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:900-BBGA, FCBGA
Supplier Device Package:900-FCBGA (31x31)
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$2,325.73
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Part Number XCZU5CG-1FBVB900I XCZU5EG-1FBVB900I   XCZU5CG-L1FBVB900I   XCZU7CG-1FBVB900I   XCZU5CG-2FBVB900I   XCZU4CG-1FBVB900I   XCZU5CG-1FBVB900E  
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size - - - - - - -
RAM Size 256KB 256KB 256KB 256KB 256KB 256KB 256KB
Peripherals DMA, WDT DMA, WDT DMA, WDT DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz 500MHz, 1.2GHz 500MHz, 1.2GHz 533MHz, 1.3GHz 500MHz, 1.2GHz 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31)

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