W25Q32FWXGBQ
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Winbond Electronics W25Q32FWXGBQ

Manufacturer No:
W25Q32FWXGBQ
Manufacturer:
Winbond Electronics
Package:
Tube
Datasheet:
W25Q32FWXGBQ Datasheet
ECAD Model:
-
Description:
IC FLASH
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:32Mb (4M x 8)
Memory Interface:SPI - Quad I/O, QPI
Clock Frequency:104 MHz
Write Cycle Time - Word, Page:60µs, 5ms
Access Time:6 ns
Voltage - Supply:1.65V ~ 1.95V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-XDFN Exposed Pad
Supplier Device Package:8-XSON (4x4)
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Similar Products

Part Number W25Q32FWXGBQ W25Q32FWXGSQ   W25Q32FVXGBQ   W25Q32FWXGAQ  
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Obsolete Obsolete Obsolete Obsolete
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 32Mb (4M x 8) 32Mb (4M x 8) 32Mb (4M x 8) 32Mb (4M x 8)
Memory Interface SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI
Clock Frequency 104 MHz 104 MHz 104 MHz 104 MHz
Write Cycle Time - Word, Page 60µs, 5ms 60µs, 5ms 50µs, 3ms 60µs, 5ms
Access Time 6 ns 6 ns 7 ns 6 ns
Voltage - Supply 1.65V ~ 1.95V 1.65V ~ 1.95V 2.7V ~ 3.6V 1.65V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-XDFN Exposed Pad 8-XDFN Exposed Pad 8-XDFN Exposed Pad 8-XDFN Exposed Pad
Supplier Device Package 8-XSON (4x4) 8-XSON (4x4) 8-XSON (4x4) 8-XSON (4x4)

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