W25M512JWEIQ
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Winbond Electronics W25M512JWEIQ

Manufacturer No:
W25M512JWEIQ
Manufacturer:
Winbond Electronics
Package:
Tray
Datasheet:
W25M512JWEIQ Datasheet
ECAD Model:
-
Description:
SPIFLASH, 1.8V, 512M-BIT, 4KB UN
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:512Mb (64M x 8)
Memory Interface:SPI
Clock Frequency:104 MHz
Write Cycle Time - Word, Page:5ms
Access Time:7 ns
Voltage - Supply:1.7V ~ 1.95V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-WDFN Exposed Pad
Supplier Device Package:8-WSON (8x6)
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In Stock

$5.56
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Similar Products

Part Number W25M512JWEIQ W25M512JWFIQ   W25M512JVEIQ   W25M512JWBIQ   W25M512JWCIQ  
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 512Mb (64M x 8) 512Mb (64M x 8) 512Mb (64M x 8) 512Mb (64M x 8) 512Mb (64M x 8)
Memory Interface SPI SPI SPI SPI SPI
Clock Frequency 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz
Write Cycle Time - Word, Page 5ms 5ms - 5ms 5ms
Access Time 7 ns 7 ns - 7 ns 7 ns
Voltage - Supply 1.7V ~ 1.95V 1.7V ~ 1.95V 2.7V ~ 3.6V 1.7V ~ 1.95V 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width) 8-WDFN Exposed Pad 24-TBGA 24-TBGA
Supplier Device Package 8-WSON (8x6) 16-SOIC 8-WSON (8x6) 24-TFBGA (6x8) 24-TFBGA (6x8)

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SPIFLASH, 1.8V, 256M-BIT, 4KB UN