W25M512JVCIQ TR
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Winbond Electronics W25M512JVCIQ TR

Manufacturer No:
W25M512JVCIQ TR
Manufacturer:
Winbond Electronics
Package:
Tape & Reel (TR)
Datasheet:
W25M512JVCIQ TR Datasheet
ECAD Model:
-
Description:
IC FLASH 512MBIT SPI 24TFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:512Mb (64M x 8)
Memory Interface:SPI
Clock Frequency:104 MHz
Write Cycle Time - Word, Page:- 
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:24-TBGA
Supplier Device Package:24-TFBGA (6x8)
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In Stock

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Similar Products

Part Number W25M512JVCIQ TR W25M512JVFIQ TR   W25M512JVEIQ TR   W25M512JWCIQ TR   W25M512JVBIQ TR  
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 512Mb (64M x 8) 512Mb (64M x 8) 512Mb (64M x 8) 512Mb (64M x 8) 512Mb (64M x 8)
Memory Interface SPI SPI SPI SPI SPI
Clock Frequency 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz
Write Cycle Time - Word, Page - - - 5ms -
Access Time - - - 7 ns -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 1.7V ~ 1.95V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 24-TBGA 16-SOIC (0.295", 7.50mm Width) 8-WDFN Exposed Pad 24-TBGA 24-TBGA
Supplier Device Package 24-TFBGA (6x8) 16-SOIC 8-WSON (8x6) 24-TFBGA (6x8) 24-TFBGA (6x8)

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