TLV2773IN
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Texas Instruments TLV2773IN

Manufacturer No:
TLV2773IN
Manufacturer:
Texas Instruments
Package:
Tube
Datasheet:
TLV2773IN Datasheet
ECAD Model:
-
Description:
IC CMOS 2 CIRCUIT 14DIP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Amplifier Type:CMOS
Number of Circuits:2
Output Type:Rail-to-Rail
Slew Rate:10.5V/µs
Gain Bandwidth Product:5.1 MHz
-3db Bandwidth:- 
Current - Input Bias:2 pA
Voltage - Input Offset:700 µV
Current - Supply:1mA (x2 Channels)
Current - Output / Channel:50 mA
Voltage - Supply Span (Min):2.5 V
Voltage - Supply Span (Max):5.5 V
Operating Temperature:-40°C ~ 125°C
Mounting Type:Through Hole
Package / Case:14-DIP (0.300", 7.62mm)
Supplier Device Package:14-PDIP
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Similar Products

Part Number TLV2773IN TLV2774IN   TLV2783IN   TLV2775IN   TLV2773AIN   TLV2773CN   TLV2773ID  
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Obsolete Active Active Obsolete Active Active Active
Amplifier Type CMOS CMOS General Purpose CMOS CMOS CMOS CMOS
Number of Circuits 2 4 2 4 2 2 2
Output Type Rail-to-Rail Rail-to-Rail Rail-to-Rail Rail-to-Rail Rail-to-Rail Rail-to-Rail Rail-to-Rail
Slew Rate 10.5V/µs 10.5V/µs 5V/µs 10.5V/µs 10.5V/µs 10.5V/µs 10.5V/µs
Gain Bandwidth Product 5.1 MHz 5.1 MHz 8 MHz 5.1 MHz 5.1 MHz 5.1 MHz 5.1 MHz
-3db Bandwidth - - - - - - -
Current - Input Bias 2 pA 2 pA 2.5 pA 2 pA 2 pA 2 pA 2 pA
Voltage - Input Offset 700 µV 700 µV 250 µV 700 µV 700 µV 700 µV 700 µV
Current - Supply 1mA (x2 Channels) 1mA (x4 Channels) 650µA (x2 Channels) 1mA (x4 Channels) 1mA (x2 Channels) 1mA (x2 Channels) 1mA (x2 Channels)
Current - Output / Channel 50 mA 50 mA 23 mA 50 mA 50 mA 50 mA 50 mA
Voltage - Supply Span (Min) 2.5 V 2.5 V 1.8 V 2.5 V 2.5 V 2.5 V 2.5 V
Voltage - Supply Span (Max) 5.5 V 5.5 V 3.6 V 5.5 V 5.5 V 5.5 V 5.5 V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C (TA) -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C (TA) 0°C ~ 70°C -40°C ~ 125°C
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole Through Hole Surface Mount
Package / Case 14-DIP (0.300", 7.62mm) 14-DIP (0.300", 7.62mm) 14-DIP (0.300", 7.62mm) 16-DIP (0.300", 7.62mm) 14-DIP (0.300", 7.62mm) 14-DIP (0.300", 7.62mm) 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package 14-PDIP 14-PDIP 14-PDIP 16-PDIP 14-PDIP 14-PDIP 14-SOIC

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