TLV2332IP
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Texas Instruments TLV2332IP

Manufacturer No:
TLV2332IP
Manufacturer:
Texas Instruments
Package:
Bulk
Datasheet:
TLV2332IP Datasheet
ECAD Model:
-
Description:
IC OPAMP GP 2 CIRCUIT 8DIP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Amplifier Type:General Purpose
Number of Circuits:2
Output Type:- 
Slew Rate:0.43V/µs
Gain Bandwidth Product:525 kHz
-3db Bandwidth:- 
Current - Input Bias:0.6 pA
Voltage - Input Offset:1.1 mV
Current - Supply:210µA (x2 Channels)
Current - Output / Channel:30 mA
Voltage - Supply Span (Min):2 V
Voltage - Supply Span (Max):8 V
Operating Temperature:-40°C ~ 85°C
Mounting Type:Through Hole
Package / Case:8-DIP (0.300", 7.62mm)
Supplier Device Package:8-PDIP
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Similar Products

Part Number TLV2332IP TLV2372IP   TLV2362IP   TLV2342IP   TLV2332IPW   TLV2322IP   TLV2332ID  
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Active Obsolete Active Active
Amplifier Type General Purpose General Purpose General Purpose CMOS General Purpose CMOS General Purpose
Number of Circuits 2 2 2 2 2 2 2
Output Type - Rail-to-Rail - - - - -
Slew Rate 0.43V/µs 2.1V/µs 3V/µs 3.6V/µs 0.43V/µs 0.03V/µs 0.43V/µs
Gain Bandwidth Product 525 kHz 3 MHz 7 MHz 1.7 MHz 525 kHz 85 kHz 525 kHz
-3db Bandwidth - - - - - - -
Current - Input Bias 0.6 pA 1 pA 20 nA 0.6 pA 0.6 pA 0.6 pA 0.6 pA
Voltage - Input Offset 1.1 mV 2 mV 1 mV 1.1 mV 1.1 mV 1.1 mV 1.1 mV
Current - Supply 210µA (x2 Channels) 750µA (x2 Channels) 1.75mA (x2 Channels) 1.4mA (x2 Channels) 210µA (x2 Channels) 20µA (x2 Channels) 210µA (x2 Channels)
Current - Output / Channel 30 mA 16 mA 20 mA 30 mA 30 mA 30 mA 30 mA
Voltage - Supply Span (Min) 2 V 2.7 V 2 V 2 V 2 V 2 V 2 V
Voltage - Supply Span (Max) 8 V 16 V 5 V 8 V 8 V 8 V 8 V
Operating Temperature -40°C ~ 85°C -40°C ~ 125°C (TA) -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C (TA) -40°C ~ 85°C
Mounting Type Through Hole Through Hole Through Hole Through Hole Surface Mount Through Hole Surface Mount
Package / Case 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-TSSOP (0.173", 4.40mm Width) 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-PDIP 8-PDIP 8-PDIP 8-PDIP 8-TSSOP 8-PDIP 8-SOIC

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