TLC27L2ACP
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Texas Instruments TLC27L2ACP

Manufacturer No:
TLC27L2ACP
Manufacturer:
Texas Instruments
Package:
Tube
Datasheet:
TLC27L2ACP Datasheet
ECAD Model:
-
Description:
IC CMOS 2 CIRCUIT 8DIP
Delivery:
Payment:
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Product Attributes

Amplifier Type:CMOS
Number of Circuits:2
Output Type:- 
Slew Rate:0.03V/µs
Gain Bandwidth Product:110 kHz
-3db Bandwidth:- 
Current - Input Bias:0.6 pA
Voltage - Input Offset:900 µV
Current - Supply:20µA (x2 Channels)
Current - Output / Channel:30 mA
Voltage - Supply Span (Min):3 V
Voltage - Supply Span (Max):16 V
Operating Temperature:0°C ~ 70°C
Mounting Type:Through Hole
Package / Case:8-DIP (0.300", 7.62mm)
Supplier Device Package:8-PDIP
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Similar Products

Part Number TLC27L2ACP TLC27L2CP   TLC27M2ACP   TLC27L2ACPS   TLC27L2BCP   TLC27L2AIP   TLC27L1ACP   TLC27L2ACD  
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Active Active Active Active Active
Amplifier Type CMOS CMOS CMOS CMOS CMOS CMOS General Purpose CMOS
Number of Circuits 2 2 2 2 2 2 1 2
Output Type - - - - - - - -
Slew Rate 0.03V/µs 0.03V/µs 0.62V/µs 0.03V/µs 0.03V/µs 0.03V/µs 0.05V/µs 0.03V/µs
Gain Bandwidth Product 110 kHz 110 kHz 635 kHz 110 kHz 110 kHz 110 kHz 110 kHz 110 kHz
-3db Bandwidth - - - - - - - -
Current - Input Bias 0.6 pA 0.6 pA 0.7 pA 0.6 pA 0.6 pA 0.6 pA 0.7 pA 0.6 pA
Voltage - Input Offset 900 µV 1.1 mV 900 µV 900 µV 204 µV 900 µV 900 µV 900 µV
Current - Supply 20µA (x2 Channels) 20µA (x2 Channels) 285µA (x2 Channels) 20µA (x2 Channels) 20µA (x2 Channels) 20µA (x2 Channels) 14µA 20µA (x2 Channels)
Current - Output / Channel 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA
Voltage - Supply Span (Min) 3 V 3 V 3 V 3 V 3 V 4 V 3 V 3 V
Voltage - Supply Span (Max) 16 V 16 V 16 V 16 V 16 V 16 V 16 V 16 V
Operating Temperature 0°C ~ 70°C 0°C ~ 70°C 0°C ~ 70°C (TA) 0°C ~ 70°C 0°C ~ 70°C -40°C ~ 85°C 0°C ~ 70°C 0°C ~ 70°C
Mounting Type Through Hole Through Hole Through Hole Surface Mount Through Hole Through Hole Through Hole Surface Mount
Package / Case 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-SOIC (0.209", 5.30mm Width) 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-PDIP 8-PDIP 8-PDIP 8-SO 8-PDIP 8-PDIP 8-PDIP 8-SOIC

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