LMC6082AIN/NOPB
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Texas Instruments LMC6082AIN/NOPB

Manufacturer No:
LMC6082AIN/NOPB
Manufacturer:
Texas Instruments
Package:
Bulk
Datasheet:
LMC6082AIN/NOPB Datasheet
ECAD Model:
-
Description:
IC CMOS 2 CIRCUIT 8DIP
Delivery:
Payment:
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Product Attributes

Amplifier Type:CMOS
Number of Circuits:2
Output Type:Push-Pull, Rail-to-Rail
Slew Rate:1.5V/µs
Gain Bandwidth Product:1.3 MHz
-3db Bandwidth:- 
Current - Input Bias:0.01 pA
Voltage - Input Offset:150 µV
Current - Supply:1.1mA (x2 Channels)
Current - Output / Channel:34 mA
Voltage - Supply Span (Min):4.5 V
Voltage - Supply Span (Max):15.5 V
Operating Temperature:-40°C ~ 85°C (TJ)
Mounting Type:Through Hole
Package / Case:8-DIP (0.300", 7.62mm)
Supplier Device Package:8-PDIP
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Similar Products

Part Number LMC6082AIN/NOPB LMC6482AIN/NOPB   LMC6082IN/NOPB   LMC6084AIN/NOPB   LMC6042AIN/NOPB   LMC6082AIM/NOPB  
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Obsolete Active Active
Amplifier Type CMOS CMOS CMOS CMOS CMOS CMOS
Number of Circuits 2 2 2 4 2 2
Output Type Push-Pull, Rail-to-Rail Rail-to-Rail Push-Pull, Rail-to-Rail Push-Pull, Rail-to-Rail Push-Pull, Rail-to-Rail Push-Pull, Rail-to-Rail
Slew Rate 1.5V/µs 1.3V/µs 1.5V/µs 1.5V/µs 0.02V/µs 1.5V/µs
Gain Bandwidth Product 1.3 MHz 1.5 MHz 1.3 MHz 1.3 MHz 100 kHz 1.3 MHz
-3db Bandwidth - - - - - -
Current - Input Bias 0.01 pA 0.02 pA 0.01 pA 0.01 pA 0.002 pA 0.01 pA
Voltage - Input Offset 150 µV 110 µV 150 µV 150 µV 1 mV 150 µV
Current - Supply 1.1mA (x2 Channels) 1.3mA (x2 Channels) 1.1mA (x2 Channels) 2.2mA (x4 Channels) 26µA (x2 Channels) 1.1mA (x2 Channels)
Current - Output / Channel 34 mA 30 mA 34 mA 34 mA 40 mA 34 mA
Voltage - Supply Span (Min) 4.5 V 3 V 4.5 V 4.5 V 4.5 V 4.5 V
Voltage - Supply Span (Max) 15.5 V 15.5 V 15.5 V 15.5 V 15.5 V 15.5 V
Operating Temperature -40°C ~ 85°C (TJ) -40°C ~ 85°C -40°C ~ 85°C (TJ) -40°C ~ 85°C -40°C ~ 85°C (TJ) -40°C ~ 85°C (TJ)
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole Surface Mount
Package / Case 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 14-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-PDIP 8-PDIP 8-PDIP 14-PDIP 8-PDIP 8-SOIC

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