LMC6082AIN
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Texas Instruments LMC6082AIN

Manufacturer No:
LMC6082AIN
Manufacturer:
Texas Instruments
Package:
Tube
Datasheet:
LMC6082AIN Datasheet
ECAD Model:
-
Description:
IC CMOS 2 CIRCUIT 8DIP
Delivery:
Payment:
iso14001
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Product Attributes

Amplifier Type:CMOS
Number of Circuits:2
Output Type:Push-Pull, Rail-to-Rail
Slew Rate:1.5V/µs
Gain Bandwidth Product:1.3 MHz
-3db Bandwidth:- 
Current - Input Bias:0.01 pA
Voltage - Input Offset:150 µV
Current - Supply:1.1mA (x2 Channels)
Current - Output / Channel:34 mA
Voltage - Supply Span (Min):4.5 V
Voltage - Supply Span (Max):15.5 V
Operating Temperature:-40°C ~ 85°C (TJ)
Mounting Type:Through Hole
Package / Case:8-DIP (0.300", 7.62mm)
Supplier Device Package:8-PDIP
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Similar Products

Part Number LMC6082AIN LMC6082IN   LMC6482AIN   LMC6042AIN   LMC6062AIN   LMC6081AIN   LMC6082AIM  
Manufacturer Texas Instruments National Semiconductor Texas Instruments National Semiconductor Texas Instruments National Semiconductor Texas Instruments
Product Status Obsolete Active Obsolete Active Obsolete Obsolete Not For New Designs
Amplifier Type CMOS CMOS CMOS CMOS CMOS General Purpose CMOS
Number of Circuits 2 2 2 2 2 1 2
Output Type Push-Pull, Rail-to-Rail Push-Pull, Rail-to-Rail Rail-to-Rail Push-Pull, Rail-to-Rail Push-Pull, Rail-to-Rail Rail-to-Rail Push-Pull, Rail-to-Rail
Slew Rate 1.5V/µs 1.5V/µs 1.3V/µs 0.02V/µs 0.035V/µs 1.5V/µs 1.5V/µs
Gain Bandwidth Product 1.3 MHz 1.3 MHz 1.5 MHz 100 kHz 100 kHz 1.3 MHz 1.3 MHz
-3db Bandwidth - - - - - - -
Current - Input Bias 0.01 pA 0.01 pA 0.02 pA 0.002 pA 0.01 pA 0.01 pA 0.01 pA
Voltage - Input Offset 150 µV 150 µV 110 µV 1 mV 100 µV 150 µV 150 µV
Current - Supply 1.1mA (x2 Channels) 1.1mA (x2 Channels) 1.3mA (x2 Channels) 26µA (x2 Channels) 40µA (x2 Channels) 550µA 1.1mA (x2 Channels)
Current - Output / Channel 34 mA 34 mA 30 mA 40 mA 35 mA 34 mA 34 mA
Voltage - Supply Span (Min) 4.5 V 4.5 V 3 V 4.5 V 4.5 V 4.5 V 4.5 V
Voltage - Supply Span (Max) 15.5 V 15.5 V 15.5 V 15.5 V 15.5 V 15.5 V 15.5 V
Operating Temperature -40°C ~ 85°C (TJ) -40°C ~ 85°C (TJ) -40°C ~ 85°C -40°C ~ 85°C (TJ) -40°C ~ 85°C (TJ) -40°C ~ 85°C -40°C ~ 85°C (TJ)
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole Through Hole Surface Mount
Package / Case 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-PDIP 8-PDIP 8-PDIP 8-PDIP 8-MDIP 8-PDIP 8-SOIC

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