LMC6001BIN
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Texas Instruments LMC6001BIN

Manufacturer No:
LMC6001BIN
Manufacturer:
Texas Instruments
Package:
Tube
Datasheet:
LMC6001BIN Datasheet
ECAD Model:
-
Description:
IC OPAMP GP 1 CIRCUIT 8DIP
Delivery:
Payment:
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Product Attributes

Amplifier Type:General Purpose
Number of Circuits:1
Output Type:Rail-to-Rail
Slew Rate:1.5V/µs
Gain Bandwidth Product:1.3 MHz
-3db Bandwidth:- 
Current - Input Bias:0.01 pA
Voltage - Input Offset:1 mV
Current - Supply:550µA
Current - Output / Channel:34 mA
Voltage - Supply Span (Min):4.5 V
Voltage - Supply Span (Max):15.5 V
Operating Temperature:-40°C ~ 85°C
Mounting Type:Through Hole
Package / Case:8-DIP (0.300", 7.62mm)
Supplier Device Package:8-PDIP
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Similar Products

Part Number LMC6001BIN LMC6001CIN   LMC6001AIN   LMC6001BIH  
Manufacturer Texas Instruments Texas Instruments National Semiconductor National Semiconductor
Product Status Obsolete Obsolete Obsolete Active
Amplifier Type General Purpose General Purpose General Purpose General Purpose
Number of Circuits 1 1 1 1
Output Type Rail-to-Rail Rail-to-Rail Rail-to-Rail Rail-to-Rail
Slew Rate 1.5V/µs 1.5V/µs 1.5V/µs 1.5V/µs
Gain Bandwidth Product 1.3 MHz 1.3 MHz 1.3 MHz 1.3 MHz
-3db Bandwidth - - - -
Current - Input Bias 0.01 pA 0.01 pA 0.01 pA 0.025 pA
Voltage - Input Offset 1 mV 1 mV 350 µV 10 mV
Current - Supply 550µA 550µA 550µA 550µA
Current - Output / Channel 34 mA - 34 mA 34 mA
Voltage - Supply Span (Min) 4.5 V 4.5 V 4.5 V 4.5 V
Voltage - Supply Span (Max) 15.5 V 15.5 V 15.5 V 15.5 V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C (TJ)
Mounting Type Through Hole Through Hole Through Hole Through Hole
Package / Case 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) TO-99-8 Metal Can
Supplier Device Package 8-PDIP 8-PDIP 8-PDIP TO-99-8

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