LM358AP
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Texas Instruments LM358AP

Manufacturer No:
LM358AP
Manufacturer:
Texas Instruments
Package:
Bulk
Datasheet:
LM358AP Datasheet
ECAD Model:
-
Description:
IC OPAMP GP 2 CIRCUIT 8DIP
Delivery:
Payment:
iso14001
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Product Attributes

Amplifier Type:General Purpose
Number of Circuits:2
Output Type:- 
Slew Rate:0.3V/µs
Gain Bandwidth Product:700 kHz
-3db Bandwidth:- 
Current - Input Bias:15 nA
Voltage - Input Offset:2 mV
Current - Supply:500µA (x2 Channels)
Current - Output / Channel:40 mA
Voltage - Supply Span (Min):3 V
Voltage - Supply Span (Max):30 V
Operating Temperature:0°C ~ 70°C (TA)
Mounting Type:Through Hole
Package / Case:8-DIP (0.300", 7.62mm)
Supplier Device Package:8-PDIP
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Similar Products

Part Number LM358AP LM358APW   LM358P   LM358APT   LM358BP   LM358AD   LM358AM   LM358AN  
Manufacturer Texas Instruments Texas Instruments Texas Instruments STMicroelectronics Texas Instruments STMicroelectronics Texas Instruments onsemi
Product Status Active Active Active Active Obsolete Active Not For New Designs Obsolete
Amplifier Type General Purpose General Purpose General Purpose General Purpose General Purpose General Purpose General Purpose General Purpose
Number of Circuits 2 2 2 2 2 2 2 2
Output Type - - - - - - - -
Slew Rate 0.3V/µs 0.3V/µs 0.3V/µs 0.6V/µs 0.5V/µs 0.6V/µs - -
Gain Bandwidth Product 700 kHz 700 kHz 700 kHz 1.1 MHz 1.2 MHz 1.1 MHz 1 MHz 1.1 MHz
-3db Bandwidth - - - - - - - -
Current - Input Bias 15 nA 15 nA 20 nA 20 nA 10 nA 20 nA 45 nA 45 nA
Voltage - Input Offset 2 mV 2 mV 3 mV 1 mV 1 mV 1 mV 2 mV 2 mV
Current - Supply 500µA (x2 Channels) 500µA (x2 Channels) 500µA (x2 Channels) 700µA (x2 Channels) 300µA (x2 Channels) 700µA (x2 Channels) 1mA 1.5mA
Current - Output / Channel 40 mA 40 mA 40 mA 40 mA 40 mA 40 mA 30 mA 40 mA
Voltage - Supply Span (Min) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Voltage - Supply Span (Max) 30 V 30 V 30 V 30 V 30 V 30 V 32 V 32 V
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 70°C (TA) 0°C ~ 70°C (TA) 0°C ~ 70°C -40°C ~ 85°C (TA) 0°C ~ 70°C 0°C ~ 70°C 0°C ~ 70°C
Mounting Type Through Hole Surface Mount Through Hole Surface Mount Surface Mount Surface Mount Surface Mount Through Hole
Package / Case 8-DIP (0.300", 7.62mm) 8-TSSOP (0.173", 4.40mm Width) 8-DIP (0.300", 7.62mm) 8-TSSOP (0.173", 4.40mm Width) 8-VFBGA 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) 8-DIP (0.300", 7.62mm)
Supplier Device Package 8-PDIP 8-TSSOP 8-PDIP 8-TSSOP 8-uSMD 8-SOIC 8-SOIC 8-DIP

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