8080-1G1
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TE Connectivity AMP Connectors 8080-1G1

Manufacturer No:
8080-1G1
Manufacturer:
TE Connectivity AMP Connectors
Package:
Bulk
Datasheet:
8080-1G1 Datasheet
ECAD Model:
-
Description:
CONN TRANSIST TO-3 4POS GOLD
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Type:Transistor, TO-3
Number of Positions or Pins (Grid):4 (Round)
Pitch - Mating:- 
Contact Finish - Mating:Tin-Lead
Contact Finish Thickness - Mating:- 
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:- 
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:- 
Contact Material - Post:Beryllium Copper
Housing Material:Fluoropolymer (FP)
Operating Temperature:-55°C ~ 125°C
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In Stock

$15.31
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Similar Products

Part Number 8080-1G1 8080-1G15   8080-1G7   8080-1G9  
Manufacturer TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors
Product Status Active Active Active Active
Type Transistor, TO-3 Transistor, TO-3 Transistor, TO-3 Transistor, TO-3
Number of Positions or Pins (Grid) 4 (Round) 3 (Oval) 4 (Round) 4 (Round)
Pitch - Mating - - - -
Contact Finish - Mating Tin-Lead Tin-Lead Gold Gold
Contact Finish Thickness - Mating - 200.0µin (5.08µm) - -
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Through Hole Chassis Mount Through Hole Through Hole
Features Closed Frame Closed Frame Closed Frame Closed Frame
Termination Solder Solder Solder Solder
Pitch - Post - - - -
Contact Finish - Post Tin-Lead Tin-Lead Gold Gold
Contact Finish Thickness - Post - 200.0µin (5.08µm) - -
Contact Material - Post Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Housing Material Fluoropolymer (FP) Fluoropolymer (FP) Fluoropolymer (FP) Fluoropolymer (FP)
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C

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