808-AG11D-ES-LF
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TE Connectivity AMP Connectors 808-AG11D-ES-LF

Manufacturer No:
808-AG11D-ES-LF
Manufacturer:
TE Connectivity AMP Connectors
Package:
Tube
Datasheet:
808-AG11D-ES-LF Datasheet
ECAD Model:
-
Description:
CONN IC DIP SOCKET 8POS GOLD
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:20.0µin (0.51µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:20.0µin (0.51µm)
Contact Material - Post:Copper
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 105°C
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Similar Products

Part Number 808-AG11D-ES-LF 808-AG11D-ESL-LF  
Manufacturer TE Connectivity AMP Connectors TE Connectivity AMP Connectors
Product Status Obsolete Obsolete
Type DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 8 (2 x 4) 8 (2 x 4)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold
Contact Finish Thickness - Mating 20.0µin (0.51µm) Flash
Contact Material - Mating Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole
Features Open Frame Open Frame
Termination Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Gold Gold
Contact Finish Thickness - Post 20.0µin (0.51µm) Flash
Contact Material - Post Copper Copper
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature -55°C ~ 105°C -55°C ~ 105°C

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