516-AG10D
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TE Connectivity AMP Connectors 516-AG10D

Manufacturer No:
516-AG10D
Manufacturer:
TE Connectivity AMP Connectors
Package:
Tube
Datasheet:
516-AG10D Datasheet
ECAD Model:
-
Description:
CONN IC DIP SOCKET 16POS GOLD
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):16 (2 x 8)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:- 
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:- 
Contact Finish Thickness - Post:- 
Contact Material - Post:Brass
Housing Material:- 
Operating Temperature:-55°C ~ 125°C
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Similar Products

Part Number 516-AG10D 516-AG11D   506-AG10D   514-AG10D  
Manufacturer TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors
Product Status Obsolete Obsolete Obsolete Obsolete
Type DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 16 (2 x 8) 16 (2 x 8) 6 (2 x 3) 14 (2 x 7)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold Gold
Contact Finish Thickness - Mating - 25.0µin (0.63µm) 25.0µin (0.63µm) -
Contact Material - Mating Beryllium Copper Copper Alloy Beryllium Copper Copper Alloy
Mounting Type Through Hole Through Hole Through Hole Through Hole
Features Closed Frame Closed Frame Closed Frame Closed Frame
Termination Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post - Tin-Lead Gold Gold
Contact Finish Thickness - Post - - 25.0µin (0.63µm) -
Contact Material - Post Brass Copper Alloy Brass Copper Alloy
Housing Material - Polyester - -
Operating Temperature -55°C ~ 125°C -55°C ~ 105°C -55°C ~ 125°C -55°C ~ 125°C

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