508-AG10D
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TE Connectivity AMP Connectors 508-AG10D

Manufacturer No:
508-AG10D
Manufacturer:
TE Connectivity AMP Connectors
Package:
Tube
Datasheet:
508-AG10D Datasheet
ECAD Model:
-
Description:
CONN IC DIP SOCKET 8POS GOLD
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:25.0µin (0.63µm)
Contact Material - Post:Copper Alloy
Housing Material:- 
Operating Temperature:-55°C ~ 125°C
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In Stock

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565

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Similar Products

Part Number 508-AG10D 506-AG10D  
Manufacturer TE Connectivity AMP Connectors TE Connectivity AMP Connectors
Product Status Obsolete Obsolete
Type DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 8 (2 x 4) 6 (2 x 3)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold
Contact Finish Thickness - Mating 25.0µin (0.63µm) 25.0µin (0.63µm)
Contact Material - Mating Copper Alloy Beryllium Copper
Mounting Type Through Hole Through Hole
Features Closed Frame Closed Frame
Termination Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Gold Gold
Contact Finish Thickness - Post 25.0µin (0.63µm) 25.0µin (0.63µm)
Contact Material - Post Copper Alloy Brass
Housing Material - -
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C

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