2-641616-1
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TE Connectivity AMP Connectors 2-641616-1

Manufacturer No:
2-641616-1
Manufacturer:
TE Connectivity AMP Connectors
Package:
Box
Datasheet:
2-641616-1 Datasheet
ECAD Model:
-
Description:
CONN IC DIP SOCKET 40POS TIN
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):40 (2 x 20)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:- 
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:- 
Contact Material - Post:Beryllium Copper
Housing Material:Thermoplastic
Operating Temperature:-55°C ~ 105°C
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In Stock

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153

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Similar Products

Part Number 2-641616-1 2-641616-2   2-641610-1   2-641611-1   2-641612-1   2-641615-1  
Manufacturer TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors
Product Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete
Type DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 40 (2 x 20) 40 (2 x 20) 16 (2 x 8) 18 (2 x 9) 20 (2 x 10) 28 (2 x 14)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Tin Gold Tin Tin Tin Tin
Contact Finish Thickness - Mating - 30.0µin (0.76µm) - - - -
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole Through Hole, Right Angle, Vertical
Features Open Frame Open Frame Closed Frame Open Frame Closed Frame Closed Frame
Termination Solder Solder Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Tin Gold Tin Tin Tin Tin
Contact Finish Thickness - Post - 30.0µin (0.76µm) - - - -
Contact Material - Post Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Housing Material Thermoplastic Thermoplastic - Thermoplastic Thermoplastic Thermoplastic, Glass Filled
Operating Temperature -55°C ~ 105°C -55°C ~ 125°C - -55°C ~ 105°C -55°C ~ 105°C -55°C ~ 105°C

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