2-641610-1
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TE Connectivity AMP Connectors 2-641610-1

Manufacturer No:
2-641610-1
Manufacturer:
TE Connectivity AMP Connectors
Package:
Tube
Datasheet:
2-641610-1 Datasheet
ECAD Model:
-
Description:
CONN IC DIP SOCKET 16POS TIN
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):16 (2 x 8)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:- 
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:- 
Contact Material - Post:Beryllium Copper
Housing Material:- 
Operating Temperature:- 
0 Remaining View Similar

In Stock

-
495

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Similar Products

Part Number 2-641610-1 2-641615-1   2-641612-1   2-641616-1   2-641611-1   2-641610-4  
Manufacturer TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors
Product Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete
Type DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 16 (2 x 8) 28 (2 x 14) 20 (2 x 10) 40 (2 x 20) 18 (2 x 9) 16 (2 x 8)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Tin Tin Tin Tin Tin Gold
Contact Finish Thickness - Mating - - - - - 15.0µin (0.38µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Phosphor Bronze
Mounting Type Through Hole Through Hole, Right Angle, Vertical Through Hole Through Hole Through Hole Through Hole
Features Closed Frame Closed Frame Closed Frame Open Frame Open Frame Open Frame
Termination Solder Solder Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Tin Tin Tin Tin Tin Gold
Contact Finish Thickness - Post - - - - - 15.0µin (0.38µm)
Contact Material - Post Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Phosphor Bronze
Housing Material - Thermoplastic, Glass Filled Thermoplastic Thermoplastic Thermoplastic -
Operating Temperature - -55°C ~ 105°C -55°C ~ 105°C -55°C ~ 105°C -55°C ~ 105°C -

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