2-1571550-9
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TE Connectivity AMP Connectors 2-1571550-9

Manufacturer No:
2-1571550-9
Manufacturer:
TE Connectivity AMP Connectors
Package:
Tube
Datasheet:
2-1571550-9 Datasheet
ECAD Model:
-
Description:
CONN IC DIP SOCKET 28POS GOLD
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:25.0µin (0.63µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 125°C
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Similar Products

Part Number 2-1571550-9 2-1571551-9   2-1571550-2   2-1571550-3   2-1571550-4   2-1571550-6   2-1571550-8  
Manufacturer TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors
Product Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete
Type DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 28 (2 x 14) 28 (2 x 14) 8 (2 x 4) 14 (2 x 7) 16 (2 x 8) 20 (2 x 10) 24 (2 x 12)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold Gold Gold Gold Gold
Contact Finish Thickness - Mating 25.0µin (0.63µm) Flash 25.0µin (0.63µm) 25.0µin (0.63µm) 25.0µin (0.63µm) 25.0µin (0.63µm) 25.0µin (0.63µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole Through Hole Through Hole
Features Closed Frame Closed Frame Closed Frame Closed Frame Closed Frame Closed Frame Closed Frame
Termination Solder Solder Solder Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Gold Gold Gold Gold Gold Gold Gold
Contact Finish Thickness - Post 25.0µin (0.63µm) Flash 25.0µin (0.63µm) 25.0µin (0.63µm) 25.0µin (0.63µm) 25.0µin (0.63µm) 25.0µin (0.63µm)
Contact Material - Post Beryllium Copper Nickel Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C

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