1-2324271-1
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TE Connectivity AMP Connectors 1-2324271-1

Manufacturer No:
1-2324271-1
Manufacturer:
TE Connectivity AMP Connectors
Package:
Tray
Datasheet:
1-2324271-1 Datasheet
ECAD Model:
-
Description:
RIGHT SEGMEN LGA4189-4 SOCKET-P4
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Type:LGA 4189
Number of Positions or Pins (Grid):2092
Pitch - Mating:0.039" (1.00mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Surface Mount
Features:Open Frame
Termination:Solder
Pitch - Post:0.034" (0.86mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Copper Alloy
Housing Material:Thermoplastic
Operating Temperature:-25°C ~ 100°C
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In Stock

$28.61
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Similar Products

Part Number 1-2324271-1 1-2324271-3   1-2324271-4   1-2324271-2   1-2324271-6   1-2324271-5   1-2324271-8   1-2324271-7  
Manufacturer TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity AMP Connectors
Product Status Active Active Active Active Active Active Active Active
Type LGA 4189 LGA 4189 LGA 4189 LGA 4189 LGA 4189 LGA 4189 LGA 4189 LGA 4189
Number of Positions or Pins (Grid) 2092 2092 2092 2092 2092 2092 2092 2092
Pitch - Mating 0.039" (1.00mm) 0.039" (1.00mm) 0.039" (1.00mm) 0.039" (1.00mm) 0.039" (1.00mm) 0.039" (1.00mm) 0.039" (1.00mm) 0.039" (1.00mm)
Contact Finish - Mating Gold Gold Gold Gold Gold Gold Gold Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) 15.0µin (0.38µm) 15.0µin (0.38µm) 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm) 15.0µin (0.38µm) 15.0µin (0.38µm)
Contact Material - Mating Copper Alloy Copper Alloy Copper Alloy Copper Alloy Copper Alloy Copper Alloy Copper Alloy Copper Alloy
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Features Open Frame Open Frame Open Frame Open Frame Open Frame Open Frame Open Frame Open Frame
Termination Solder Solder Solder Solder Solder Solder Solder Solder
Pitch - Post 0.034" (0.86mm) 0.034" (0.86mm) 0.034" (0.86mm) 0.034" (0.86mm) 0.034" (0.86mm) 0.034" (0.86mm) 0.034" (0.86mm) 0.034" (0.86mm)
Contact Finish - Post Gold Gold Gold Gold Gold Gold Gold Gold
Contact Finish Thickness - Post 30.0µin (0.76µm) 15.0µin (0.38µm) 15.0µin (0.38µm) 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm) 15.0µin (0.38µm) 15.0µin (0.38µm)
Contact Material - Post Copper Alloy Copper Alloy Copper Alloy Copper Alloy Copper Alloy Copper Alloy Copper Alloy Copper Alloy
Housing Material Thermoplastic Thermoplastic Thermoplastic Thermoplastic Thermoplastic Thermoplastic Thermoplastic Thermoplastic
Operating Temperature -25°C ~ 100°C -25°C ~ 100°C -25°C ~ 100°C -25°C ~ 100°C -25°C ~ 100°C -25°C ~ 100°C -25°C ~ 100°C -25°C ~ 100°C

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