1-1825376-3
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TE Connectivity AMP Connectors 1-1825376-3

Manufacturer No:
1-1825376-3
Manufacturer:
TE Connectivity AMP Connectors
Package:
Tube
Datasheet:
1-1825376-3 Datasheet
ECAD Model:
-
Description:
CONN IC DIP SOCKET 40POS GOLD
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):40 (2 x 20)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Beryllium Copper
Housing Material:Thermoplastic, Glass Filled
Operating Temperature:-55°C ~ 125°C
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Similar Products

Part Number 1-1825376-3 1-1825376-2  
Manufacturer TE Connectivity AMP Connectors TE Connectivity AMP Connectors
Product Status Active Active
Type DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 40 (2 x 20) 28 (2 x 14)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) 30.0µin (0.76µm)
Contact Material - Mating Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole
Features Open Frame Closed Frame
Termination Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Gold Gold
Contact Finish Thickness - Post 30.0µin (0.76µm) 30.0µin (0.76µm)
Contact Material - Post Beryllium Copper Beryllium Copper
Housing Material Thermoplastic, Glass Filled Thermoplastic, Glass Filled
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C

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