Renesas Electronics America Inc-UPD70F3529GMA9-GBK-Q-G - Embedded - Microcontrollers Product Specifications and Latest Quotes

Core Processor:	V850E2M
Core Size:	32-Bit Single-Core
Speed:	80MHz
Connectivity:	CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals:	DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O:	127
Program Memory Size:	2GB (2G x 8)
Program Memory Type:	Flash
EEPROM Size:	32K x 8
RAM Size:	96K x 8
Voltage - Supply (Vcc/Vdd):	2.7V ~ 5.5V
Data Converters:	A/D 12x10b, 12x12b
Oscillator Type:	Internal
Operating Temperature:	-40°C ~ 105°C (TA)
Mounting Type:	Surface Mount
Package / Case:	176-LQFP Exposed Pad
Supplier Device Package:	176-HLQFP (24x24)

Renesas Electronics America Inc UPD70F3529GMA9-GBK-Q-G