LMC6572BIN
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National Semiconductor LMC6572BIN

Manufacturer No:
LMC6572BIN
Manufacturer:
National Semiconductor
Package:
Tube
Datasheet:
LMC6572BIN Datasheet
ECAD Model:
-
Description:
IC OPAMP GP 2 CIRCUIT 8MDIP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Amplifier Type:General Purpose
Number of Circuits:2
Output Type:Push-Pull, Rail-to-Rail
Slew Rate:0.09V/µs
Gain Bandwidth Product:220 kHz
-3db Bandwidth:- 
Current - Input Bias:10 pA
Voltage - Input Offset:500 µV
Current - Supply:160µA (x2 Channels)
Current - Output / Channel:6 mA
Voltage - Supply Span (Min):2.7 V
Voltage - Supply Span (Max):11 V
Operating Temperature:-40°C ~ 85°C (TJ)
Mounting Type:Through Hole
Package / Case:8-DIP (0.300", 7.62mm)
Supplier Device Package:8-MDIP
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Similar Products

Part Number LMC6572BIN LMC6574BIN   LMC6572BIM  
Manufacturer National Semiconductor National Semiconductor National Semiconductor
Product Status Obsolete Obsolete Obsolete
Amplifier Type General Purpose General Purpose General Purpose
Number of Circuits 2 4 2
Output Type Push-Pull, Rail-to-Rail Push-Pull, Rail-to-Rail Push-Pull, Rail-to-Rail
Slew Rate 0.09V/µs 0.09V/µs 0.09V/µs
Gain Bandwidth Product 220 kHz 220 kHz 220 kHz
-3db Bandwidth - - -
Current - Input Bias 10 pA 10 pA 10 pA
Voltage - Input Offset 500 µV 500 µV 500 µV
Current - Supply 160µA (x2 Channels) 160µA (x4 Channels) 160µA (x2 Channels)
Current - Output / Channel 6 mA 6 mA 6 mA
Voltage - Supply Span (Min) 2.7 V 2.7 V 2.7 V
Voltage - Supply Span (Max) 11 V 11 V 11 V
Operating Temperature -40°C ~ 85°C (TJ) -40°C ~ 85°C (TJ) -40°C ~ 85°C (TJ)
Mounting Type Through Hole Through Hole Surface Mount
Package / Case 8-DIP (0.300", 7.62mm) 14-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-MDIP 14-PDIP 8-SOIC

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