XPC850DEZT50BU
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NXP USA Inc. XPC850DEZT50BU

Manufacturer No:
XPC850DEZT50BU
Manufacturer:
NXP USA Inc.
Package:
Tray
Datasheet:
XPC850DEZT50BU Datasheet
ECAD Model:
-
Description:
IC MPU MPC8XX 50MHZ 256BGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Core Processor:MPC8xx
Number of Cores/Bus Width:1 Core, 32-Bit
Speed:50MHz
Co-Processors/DSP:Communications; CPM
RAM Controllers:DRAM
Graphics Acceleration:No
Display & Interface Controllers:- 
Ethernet:10Mbps (1)
SATA:- 
USB:USB 1.x (1)
Voltage - I/O:3.3V
Operating Temperature:0°C ~ 95°C (TA)
Security Features:- 
Package / Case:256-BGA
Supplier Device Package:256-PBGA (23x23)
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In Stock

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Similar Products

Part Number XPC850DEZT50BU XPC850DEZT80BU   XPC850DECZT50BU   XPC850DEZT50BT  
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Obsolete Obsolete Obsolete Obsolete
Core Processor MPC8xx MPC8xx MPC8xx MPC8xx
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit
Speed 50MHz 80MHz 50MHz 50MHz
Co-Processors/DSP Communications; CPM Communications; CPM Communications; CPM Communications; CPM
RAM Controllers DRAM DRAM DRAM DRAM
Graphics Acceleration No No No No
Display & Interface Controllers - - - -
Ethernet 10Mbps (1) 10Mbps (1) 10Mbps (1) 10Mbps (1)
SATA - - - -
USB USB 1.x (1) USB 1.x (1) USB 1.x (1) USB 1.x (1)
Voltage - I/O 3.3V 3.3V 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) 0°C ~ 95°C (TA) -40°C ~ 95°C (TA) 0°C ~ 95°C (TA)
Security Features - - - -
Package / Case 256-BGA 256-BGA 256-BGA 256-BGA
Supplier Device Package 256-PBGA (23x23) 256-PBGA (23x23) 256-PBGA (23x23) 256-PBGA (23x23)

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