NXP USA Inc.-SPC5775BDK3MME2 - Embedded - Microcontrollers Product Specifications and Latest Quotes

Core Processor:	e200z7
Core Size:	32-Bit Dual-Core
Speed:	220MHz
Connectivity:	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:	DMA, LVD, POR, Zipwire
Number of I/O:	293
Program Memory Size:	4MB (4M x 8)
Program Memory Type:	Flash
EEPROM Size:	-
RAM Size:	512K x 8
Voltage - Supply (Vcc/Vdd):	3V ~ 5.5V
Data Converters:	A/D 40x12b eQADCx2
Oscillator Type:	External
Operating Temperature:	-40°C ~ 125°C (TA)
Mounting Type:	Surface Mount
Package / Case:	416-BGA
Supplier Device Package:	416-MAPBGA (27x27)

NXP USA Inc. SPC5775BDK3MME2