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SPC5775BDK3MME2
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NXP USA Inc. SPC5775BDK3MME2

Manufacturer No:
SPC5775BDK3MME2
Manufacturer:
NXP USA Inc.
Package:
Tray
Datasheet:
SPC5775BDK3MME2 Datasheet
ECAD Model:
-
Description:
IC MCU 32BIT 4MB FLASH 416MAPBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Core Processor:e200z7
Core Size:32-Bit Dual-Core
Speed:220MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:DMA, LVD, POR, Zipwire
Number of I/O:293
Program Memory Size:4MB (4M x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:512K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 40x12b eQADCx2
Oscillator Type:External
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:416-BGA
Supplier Device Package:416-MAPBGA (27x27)
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$48.87
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