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| Part Number | MC9S12XEP100CVL | MC9S12XEP100MVL | MC9S12XEP100CAL |
|---|---|---|---|
| Manufacturer | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
| Product Status | Active | Active | Active |
| Core Processor | HCS12X | HCS12X | HCS12X |
| Core Size | 16-Bit | 16-Bit | 16-Bit |
| Speed | 50MHz | 50MHz | 50MHz |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
| Number of I/O | 152 | 152 | 91 |
| Program Memory Size | 1MB (1M x 8) | 1MB (1M x 8) | 1MB (1M x 8) |
| Program Memory Type | Flash | Flash | Flash |
| EEPROM Size | 4K x 8 | 4K x 8 | 4K x 8 |
| RAM Size | 64K x 8 | 64K x 8 | 64K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.72V ~ 5.5V | 1.72V ~ 5.5V | 1.72V ~ 5.5V |
| Data Converters | A/D 32x12b | A/D 32x12b | A/D 16x12b |
| Oscillator Type | External | External | External |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | 208-BGA | 208-BGA | 112-LQFP |
| Supplier Device Package | 208-BGA (17x17) | 208-BGA (17x17) | 112-LQFP (20x20) |
