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| Part Number | MC33PF8200EMES | MC33PF8200ESES | MC33PF8200ETES | MC33PF8200DMES |
|---|---|---|---|---|
| Manufacturer | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
| Product Status | Active | Active | Active | Active |
| Applications | High Performance i.MX 8, S32x Processor Based | High Performance i.MX 8, S32x Processor Based | High Performance i.MX 8, S32x Processor Based | High Performance i.MX 8, S32x Processor Based |
| Current - Supply | - | - | - | - |
| Voltage - Supply | 2.5V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.5V ~ 5.5V |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad | 56-VFQFN Exposed Pad | 56-VFQFN Exposed Pad | 56-VFQFN Exposed Pad |
| Supplier Device Package | 56-HVQFN (8x8) | 56-HVQFN (8x8) | 56-HVQFN (8x8) | 56-HVQFN (8x8) |
