MC33PF8100EPESR2
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NXP USA Inc. MC33PF8100EPESR2

Manufacturer No:
MC33PF8100EPESR2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Datasheet:
MC33PF8100EPESR2 Datasheet
ECAD Model:
-
Description:
POWER MANAGEMENT IC I.MX8 PRE-PR
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Applications:High Performance i.MX 8, S32x Processor Based
Current - Supply:- 
Voltage - Supply:2.5V ~ 5.5V
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount, Wettable Flank
Package / Case:56-VFQFN Exposed Pad
Supplier Device Package:56-HVQFN (8x8)
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In Stock

$12.19
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Similar Products

Part Number MC33PF8100EPESR2 MC33PF8100ERESR2   MC33PF8100EQESR2   MC33PF8100EAESR2  
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active
Applications High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based
Current - Supply - - - -
Voltage - Supply 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad
Supplier Device Package 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8)

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