MC33PF8100A0ESR2
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NXP USA Inc. MC33PF8100A0ESR2

Manufacturer No:
MC33PF8100A0ESR2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Datasheet:
MC33PF8100A0ESR2 Datasheet
ECAD Model:
-
Description:
POWER MANAGEMENT IC I.MX8 NON-PR
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Applications:High Performance i.MX 8, S32x Processor Based
Current - Supply:- 
Voltage - Supply:2.5V ~ 5.5V
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount, Wettable Flank
Package / Case:56-VFQFN Exposed Pad
Supplier Device Package:56-HVQFN (8x8)
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$10.28
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Similar Products

Part Number MC33PF8100A0ESR2 MC33PF8101A0ESR2   MC33PF8200A0ESR2  
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active
Applications High Performance i.MX 8, S32x Processor Based High Performance i.MX 8 Processor Based High Performance i.MX 8, S32x Processor Based
Current - Supply - - -
Voltage - Supply 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad
Supplier Device Package 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8)

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