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MC33HB2000EKR2
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NXP USA Inc. MC33HB2000EKR2

Manufacturer No:
MC33HB2000EKR2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Datasheet:
MC33HB2000EKR2 Datasheet
ECAD Model:
-
Description:
H-BRIDGE SPI BRUSHED DC MOTOR
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Output Configuration:Half Bridge
Applications:DC Motors, General Purpose
Interface:Logic, PWM, SPI
Load Type:Inductive
Technology:Power MOSFET
Rds On (Typ):235mOhm LS + HS (Max)
Current - Output / Channel:3A
Current - Peak Output:16A
Voltage - Supply:3.3V ~ 5V
Voltage - Load:5V ~ 28V
Operating Temperature:-40°C ~ 125°C (TJ)
Features:Charge Pump, Slew Rate Controlled, Status Flag
Fault Protection:Over Temperature, Short Circuit, UVLO
Mounting Type:Surface Mount
Package / Case:32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package:32-SOIC-EP
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In Stock

$6.88
121

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