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| Part Number | LPC55S66JBD64K | LPC55S69JBD64K | LPC55S26JBD64K |
|---|---|---|---|
| Manufacturer | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
| Product Status | Active | Active | Active |
| Core Processor | ARM® Cortex®-M33 | ARM® Cortex®-M33 | ARM® Cortex®-M33 |
| Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
| Speed | 150MHz | 150MHz | 150MHz |
| Connectivity | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Number of I/O | 36 | 36 | 36 |
| Program Memory Size | 256KB (256K x 8) | 640KB (640K x 8) | 256KB (256K x 8) |
| Program Memory Type | Flash | Flash | Flash |
| EEPROM Size | - | - | - |
| RAM Size | 144K x 8 | 320K x 8 | 144K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V |
| Data Converters | A/D 10x16b | A/D 10x16b | A/D 10x16b |
| Oscillator Type | Internal | Internal | Internal |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | 64-TQFP Exposed Pad | 64-TQFP Exposed Pad | 64-TQFP Exposed Pad |
| Supplier Device Package | 64-HTQFP (10x10) | 64-HTQFP (10x10) | 64-HTQFP (10x10) |
