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| Part Number | LPC1112FHN33/103,5 | LPC1112FHN33/203,5 | LPC1111FHN33/103,5 | LPC1112FHN33/101,5 | LPC1112FHN33/102,5 |
|---|---|---|---|---|---|
| Manufacturer | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
| Product Status | Active | Active | Discontinued at Digi-Key | Active | Discontinued at Digi-Key |
| Core Processor | ARM® Cortex®-M0 | ARM® Cortex®-M0 | ARM® Cortex®-M0 | ARM® Cortex®-M0 | ARM® Cortex®-M0 |
| Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
| Speed | 50MHz | 50MHz | 50MHz | 50MHz | 50MHz |
| Connectivity | I²C, SPI, UART/USART | I²C, SPI, UART/USART | I²C, SPI, UART/USART | I²C, SPI, UART/USART | I²C, SPI, UART/USART |
| Peripherals | Brown-out Detect/Reset, POR, WDT | Brown-out Detect/Reset, POR, WDT | Brown-out Detect/Reset, POR, WDT | Brown-out Detect/Reset, POR, WDT | Brown-out Detect/Reset, POR, WDT |
| Number of I/O | 28 | 28 | 28 | 28 | 28 |
| Program Memory Size | 16KB (16K x 8) | 16KB (16K x 8) | 8KB (8K x 8) | 16KB (16K x 8) | 16KB (16K x 8) |
| Program Memory Type | Flash | Flash | Flash | Flash | Flash |
| EEPROM Size | - | - | - | - | - |
| RAM Size | 2K x 8 | 4K x 8 | 2K x 8 | 2K x 8 | 2K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V |
| Data Converters | A/D 8x10b | A/D 8x10b | A/D 8x10b | A/D 8x10b | A/D 8x10b |
| Oscillator Type | Internal | Internal | Internal | Internal | Internal |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | 32-VQFN Exposed Pad | 32-VQFN Exposed Pad | 32-VQFN Exposed Pad | 32-VQFN Exposed Pad | 32-VQFN Exposed Pad |
| Supplier Device Package | 32-HVQFN (7x7) | 32-HVQFN (7x7) | 32-HVQFN (7x7) | 32-HVQFN (7x7) | 32-HVQFN (7x7) |
