Molex-1051420133 - Sockets for ICs, Transistors Product Specifications and Latest Quotes

Type:	LGA
Number of Positions or Pins (Grid):	2011 (47 x 58)
Pitch - Mating:	0.040" (1.02mm)
Contact Finish - Mating:	Gold
Contact Finish Thickness - Mating:	30.0µin (0.76µm)
Contact Material - Mating:	Copper Alloy
Mounting Type:	Surface Mount
Features:	Open Frame
Termination:	Solder
Pitch - Post:	0.040" (1.01mm)
Contact Finish - Post:	-
Contact Finish Thickness - Post:	-
Contact Material - Post:	-
Housing Material:	Thermoplastic
Operating Temperature:	-

Molex 1051420133