Microsemi Corporation-M2S100-FC1152 - Embedded - System On Chip (SoC) Product Specifications and Latest Quotes

Part Number	M2S100-FC1152	M2S150-FC1152	M2S100-FCG1152	M2S100T-FC1152	M2S100-1FC1152
Manufacturer	Microsemi Corporation	Microchip Technology	Microsemi Corporation	Microsemi Corporation	Microsemi Corporation
Product Status	Obsolete	Active	Obsolete	Obsolete	Obsolete
Architecture	MCU, FPGA	MCU, FPGA	MCU, FPGA	MCU, FPGA	MCU, FPGA
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3
Flash Size	512KB	512KB	512KB	512KB	512KB
RAM Size	64KB	64KB	64KB	64KB	64KB
Peripherals	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed	166MHz	166MHz	166MHz	166MHz	166MHz
Primary Attributes	FPGA - 100K Logic Modules	FPGA - 150K Logic Modules	FPGA - 100K Logic Modules	FPGA - 100K Logic Modules	FPGA - 100K Logic Modules
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)
Package / Case	1152-BBGA, FCBGA	1152-BBGA, FCBGA	1152-BBGA, FCBGA	1152-BBGA, FCBGA	1152-BBGA, FCBGA
Supplier Device Package	1152-FCBGA (35x35)	1152-FCBGA (35x35)	1152-FCBGA (35x35)	1152-FCBGA (35x35)	1152-FCBGA (35x35)

Microsemi Corporation M2S100-FC1152

Architecture:	MCU, FPGA
Core Processor:	ARM® Cortex®-M3
Flash Size:	512KB
RAM Size:	64KB
Peripherals:	DDR, PCIe, SERDES
Connectivity:	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed:	166MHz
Primary Attributes:	FPGA - 100K Logic Modules
Operating Temperature:	0°C ~ 85°C (TJ)
Package / Case:	1152-BBGA, FCBGA
Supplier Device Package:	1152-FCBGA (35x35)