Microsemi Corporation-M2S090-1FG676IX417 - Embedded - System On Chip (SoC) Product Specifications and Latest Quotes

Architecture:	MCU, FPGA
Core Processor:	ARM® Cortex®-M3
Flash Size:	512KB
RAM Size:	64KB
Peripherals:	DDR, PCIe, SERDES
Connectivity:	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed:	166MHz
Primary Attributes:	FPGA - 90K Logic Modules
Operating Temperature:	-40°C ~ 100°C (TJ)
Package / Case:	676-BGA
Supplier Device Package:	676-FBGA (27x27)

Microsemi Corporation M2S090-1FG676IX417