Microchip Technology-M2S060TS-1FGG676 - Embedded - System On Chip (SoC) Product Specifications and Latest Quotes

Part Number	M2S060TS-1FGG676	M2S060TS-FGG676	M2S060TS-1FGG676I	M2S090TS-1FGG676	M2S060T-1FGG676	M2S060TS-1FG676
Manufacturer	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology
Product Status	Active	Active	Active	Active	Active	Active
Architecture	MCU, FPGA	MCU, FPGA	MCU, FPGA	MCU, FPGA	MCU, FPGA	MCU, FPGA
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3
Flash Size	256KB	256KB	256KB	512KB	256KB	256KB
RAM Size	64KB	64KB	64KB	64KB	64KB	64KB
Peripherals	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed	166MHz	166MHz	166MHz	166MHz	166MHz	166MHz
Primary Attributes	FPGA - 60K Logic Modules	FPGA - 60K Logic Modules	FPGA - 60K Logic Modules	FPGA - 90K Logic Modules	FPGA - 60K Logic Modules	FPGA - 60K Logic Modules
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)	-40°C ~ 100°C (TJ)	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)
Package / Case	676-BGA	676-BGA	676-BGA	676-BGA	676-BGA	676-BGA
Supplier Device Package	676-FBGA (27x27)	676-FBGA (27x27)	676-FBGA (27x27)	676-FBGA (27x27)	676-FBGA (27x27)	676-FBGA (27x27)

Microchip Technology M2S060TS-1FGG676

Architecture:	MCU, FPGA
Core Processor:	ARM® Cortex®-M3
Flash Size:	256KB
RAM Size:	64KB
Peripherals:	DDR, PCIe, SERDES
Connectivity:	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed:	166MHz
Primary Attributes:	FPGA - 60K Logic Modules
Operating Temperature:	0°C ~ 85°C (TJ)
Package / Case:	676-BGA
Supplier Device Package:	676-FBGA (27x27)