Microchip Technology-M2S050-1FCSG325 - Embedded - System On Chip (SoC) Product Specifications and Latest Quotes

Part Number	M2S050-1FCSG325	M2S050-FCSG325	M2S050T-1FCSG325	M2S050-1FCSG325I	M2S050-1FCS325
Manufacturer	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology
Product Status	Active	Active	Active	Active	Active
Architecture	MCU, FPGA	MCU, FPGA	MCU, FPGA	MCU, FPGA	MCU, FPGA
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3
Flash Size	256KB	256KB	256KB	256KB	256KB
RAM Size	64KB	64KB	64KB	64KB	64KB
Peripherals	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed	166MHz	166MHz	166MHz	166MHz	166MHz
Primary Attributes	FPGA - 50K Logic Modules	FPGA - 50K Logic Modules	FPGA - 50K Logic Modules	FPGA - 50K Logic Modules	FPGA - 50K Logic Modules
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)	-40°C ~ 100°C (TJ)	0°C ~ 85°C (TJ)
Package / Case	325-TFBGA, FCBGA	325-TFBGA, FCBGA	325-TFBGA, FCBGA	325-TFBGA, FCBGA	325-TFBGA, FCBGA
Supplier Device Package	325-FCBGA (11x11)	325-FCBGA (11x11)	325-FCBGA (11x11)	325-FCBGA (11x11)	325-FCBGA (11x11)

Microchip Technology M2S050-1FCSG325

Architecture:	MCU, FPGA
Core Processor:	ARM® Cortex®-M3
Flash Size:	256KB
RAM Size:	64KB
Peripherals:	DDR, PCIe, SERDES
Connectivity:	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed:	166MHz
Primary Attributes:	FPGA - 50K Logic Modules
Operating Temperature:	0°C ~ 85°C (TJ)
Package / Case:	325-TFBGA, FCBGA
Supplier Device Package:	325-FCBGA (11x11)