Microchip Technology-M2S010TS-1FGG484 - Embedded - System On Chip (SoC) Product Specifications and Latest Quotes

Part Number	M2S010TS-1FGG484	M2S010TS-FGG484	M2S010TS-1FGG484I	M2S010TS-1FGG484M	M2S010T-1FGG484	M2S010TS-1FG484
Manufacturer	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology
Product Status	Active	Active	Active	Active	Active	Active
Architecture	MCU, FPGA	MCU, FPGA	MCU, FPGA	MCU, FPGA	MCU, FPGA	MCU, FPGA
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3	ARM® Cortex®-M3
Flash Size	256KB	256KB	256KB	256KB	256KB	256KB
RAM Size	64KB	64KB	64KB	64KB	64KB	64KB
Peripherals	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed	166MHz	166MHz	166MHz	166MHz	166MHz	166MHz
Primary Attributes	FPGA - 10K Logic Modules	FPGA - 10K Logic Modules	FPGA - 10K Logic Modules	FPGA - 10K Logic Modules	FPGA - 10K Logic Modules	FPGA - 10K Logic Modules
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)	-40°C ~ 100°C (TJ)	-55°C ~ 125°C (TJ)	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)
Package / Case	484-BGA	484-BGA	484-BGA	484-BGA	484-BGA	484-BGA
Supplier Device Package	484-FPBGA (23x23)	484-FPBGA (23x23)	484-FPBGA (23x23)	484-FPBGA (23x23)	484-FPBGA (23x23)	484-FPBGA (23x23)

Microchip Technology M2S010TS-1FGG484

Architecture:	MCU, FPGA
Core Processor:	ARM® Cortex®-M3
Flash Size:	256KB
RAM Size:	64KB
Peripherals:	DDR, PCIe, SERDES
Connectivity:	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed:	166MHz
Primary Attributes:	FPGA - 10K Logic Modules
Operating Temperature:	0°C ~ 85°C (TJ)
Package / Case:	484-BGA
Supplier Device Package:	484-FPBGA (23x23)